CVE-2022-22071
גבוהה 7.8 מנוצלת בשטח (KEV)
ניצול פעיל מאומת — קטלוג CISA KEV
- שם
- Qualcomm Multiple Chipsets Use-After-Free Vulnerability
- נוסף לקטלוג
- יעד טיפול (פדרלי)
- פעולה נדרשת
- Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
תיאור (מקור, אנגלית)
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
מדדים
- CVSS 3.1
-
7.8 (HIGH)
מקור הציון: NVD
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H - EPSS — סבירות ניצול
- 0% (אחוזון 000) נכון ל-25/7/2026
- CWE
- CWE-416
מוצרים מושפעים
qualcomm: apq8053 firmware; qualcomm: apq8053; qualcomm: ar8031 firmware; qualcomm: ar8031; qualcomm: ar8035 firmware; qualcomm: ar8035; qualcomm: csra6620 firmware; qualcomm: csra6620; qualcomm: csra6640 firmware; qualcomm: csra6640; qualcomm: mdm9150 firmware; qualcomm: mdm9150; qualcomm: msm8953 firmware; qualcomm: msm8953; qualcomm: qca6174a firmware
קישורים
- https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin PatchVendor Advisory
- https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin PatchVendor Advisory
- https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-202… US Government Resource